Item

Capacity

number of stratus

1-12 Layer

Capacity / PP

Max. board thickness

125.98mil (3.20mm)

Min. board thickness (4-substrate)

14.96 mil (0.38mm)

Min. board thickness (2-substrate)

8mil (0.2mm)

Min. board thickness

3 mil (0.075mm) the thickness doesn’t include copper

Max. Size

550X 450mm

Copper thickness

Inner layer copper thickness

0.3 oz~2.0 oz

Outer layer copper thickness

0.3 oz~4.0oz

Through hole trace stack up

Minimum drill size

6 mil (0.15mm)

Max. width

12/1

wiring layout

Line width / spacing in outer layer

3/3 mil

Line width / spacing in inner layer

3/3 mil

Pitch limited SMT spacing

6mil (0.15 mm)

Pitch limited BGA spacing

5 mil (0.127 mm)

Soldering and surface handling

Limited solder mask print width

3 mil (0.075 mm)

Solder positioning and accuracy control

± 2 mil

Others

Impedance control

Ω ± 10%

Layer registration tolerance control

± 4 mil (0.1 mm)

Board thickness tolerance control

± 5%